The future is quantum. Oxford Ionics is at the forefront of pioneering quantum computing, delivering world-leading innovation to create the most powerful, accurate, and reliable quantum systems. Quantum computing offers a radically new way of building computers that harnesses the power of quantum physics to outperform conventional supercomputers exponentially. Using our unique trapped-ion technology, we are leading the race to unleash quantum computing's unparalleled potential.

What to expect:

We’re building the world’s highest-performing quantum computers to revolutionise society’s ability to solve era-defining challenges. We design and manufacture full-stack quantum computers based on trapped-ion qubits, with a technology stack that includes custom compilers, embedded firmware, mixed-signal and RF electronics, cryogenics, vacuum systems, lasers, chip design and more.

At the heart of our quantum computers are Quantum Processing Units (QPUs) and in this role you will lead the team which designs, produces and tests these QPUs: the Quantum Processor Engineering (QPE) team. We are looking for a semiconductor chip generalist who is comfortable leading a team working across the full range of physical design, fabrication, packaging, test and characterisation.

What you'll be responsible for:

You will be the technical lead for the QPE team, which currently has 8 staff members, and is expected to grow to 12 staff over the next 12 months. You will be responsible for working with other team leads across the technology stack and executive management to set technical direction for the QPE team, ensuring the QPUs meet the required quality levels and address the company’s needs.

The QPE team’s responsibilities include:

• Development of custom semiconductor processes, including 3D electrostatic design, integrated photonics, integrated RF antennas and the impact of cryogenic temperatures
• Rapid production of devices in prototype quantities, both in our in-house fabrication facilities and with industrial partners
• Rapid-turn packaging of the quantum processor devices in prototype quantities to take account of critical thermal management
• Low-volume manufacturing test and characterisation of non-quantum parameters of the devices

At this point in our development, speed is everything - we need to make rapid iterations of our devices, understanding where key risks need to be addressed now and where others can be deferred to later stages of development.

Requirements

You will need over 10 years of experience in the microelectronics or photonics industry, with a strong track record of bringing devices from design through to prototyping or early-stage production. You should have demonstrated technical leadership in one or more of the following areas: microfabrication, microelectronics, integrated photonics or packaging. Excellent communication skills are essential, along with the ability to navigate uncertainty and respond with agility to fast changing product requirements. 

Ideally, you will also have expertise across multiple aspects of chip development, such as analog/digital design, multiphysics simulations, fabrication process development, advanced packaging and device testing. Familiarity with chip fabrication and packaging processes will further strengthen your fit for this role.

Benefits

Oxford Ionics is leading the way in quantum technology, and we need skilled, innovative individuals like you. We offer a range of benefits, including opportunities to further your career with a world-class team, business stock options, uncapped annual leave, flexible working, private medical and dental insurance for you and your family, and much more. Join us and be part of the future of quantum computing.

Oxford Ionics is committed to equal opportunity for all.