Key Responsibilities:

• Participate in all stages of development and manufacturing of microfabricated ion traps, including new concept creation, design, layout, fabrication, packaging and characterization
• Assess requirements of current and future ion traps, and specify or develop designs and processes meeting those requirements
• Work closely with an integrated team of scientists, engineers and technicians to translate system requirements and designs into functional hardware
• Engage with 3rd parties to cultivate possible key partnerships, supplier relationships, and co-development opportunities
• Contribute to strategic, long-range planning for future trap designs and processes

YOU MUST HAVE:

• Bachelor's degree minimum
• Minimum 4+ years' experience in one or more of the following areas: MEMS fabrication, IC fabrication, integrated optics of waveguides, and chip-scale photonics
• Minimum 4+ years' experience applying physics to device designs
• Due to Contractual requirements, must be a U.S. Person. defined as, U.S. citizen permanent resident or green card holder, workers granted asylum or refugee status

WE VAUE:

• PhD in Physics, Materials Science or Engineering
• Experiencing interfacing with a semiconductor foundry
• Relevant experience with process integration in a micro-fabrication manufacturing environment
• Relevant work experience in a micro-fabrication development environment
• Experience with a wide range of semiconductor/MEMS processes and processing tools including layout, thin film deposition, additive and subtractive patterning, photolithography, deep reactive ion etching, and process integration
• Knowledge of on-chip photonics, wafer fabrication and fiber-to-chip coupling
• 5+ years' experience with integrated circuit layout and simulation in Cadence Virtuoso, including inserting, modifying and using a PDK in Cadence or MEMS layout in Tanner L-Edit, K-Layout or similar
• 3+ years' experience with 2.5/3D photonics, MEMS or IC packaging
• Experience with Finite Element Modeling (mechanical, thermal, electrical, magnetic, optical and multi-physics) of MEMS-like structures
• Experience with 2.5/3D semiconductor packaging
• Experience working in an R&D environment
• Published results within their field of research
• Experience working within a cross-functional team environment
• Individuals who are results-oriented and able to work with little supervision, who consistently take the initiative to get things done despite competing priorities
• Good interpersonal skills, verbal and written
• Fluency in German is a plus

PI255073450