The future is quantum. Oxford Ionics is at the forefront of pioneering quantum computing, delivering world-leading innovation to create the most powerful, accurate, and reliable quantum systems. Quantum computing offers a radically new way of building computers that harnesses the power of quantum physics to outperform conventional supercomputers exponentially. Using our unique trapped-ion technology, we are leading the race to unleash quantum computing's unparalleled potential.
What to expect:
Core to our mission at Oxford Ionics is the scaling of quantum compute devices and systems in a technologically realistic and cost-effective way. To do this, we design our own quantum processors which require novel packaging methods for electrical connections, photonic connections and free space optics. We perform some of the early prototyping in-house and engage with third-party companies for process development and manufacture.
We are looking for an experienced packaging engineer to steer the packaging roadmap, working with internal and external providers to develop and produce our quantum processor devices. The successful candidate will have experience of electrical and photonic packaging methods alongside a clear track record of managing internal stakeholders and external suppliers. We are not expecting this to be a hands-on role, but the ability for clear and insightful technical thinking is a must.
What you'll be responsible for:
You will be responsible for leading the packaging technology development for our quantum processor devices, driving the roadmap and ensuring delivery of scalable, high-performance packaging approaches.
Key responsibilities:
- Advancing photonic and cryogenic packaging: Develop innovative photonic packaging techniques across a wide range of frequencies at cryogenic temperatures, and ensure chip bonding with good thermal performance.
- Developing wirebonding and bumping methods: Design and evolve wirebonding and bumping methods to support complex quantum devices, scaling from tens to thousands of electrical connections while maintaining signal integrity and cryogenic compatibility.
- Engaging with suppliers and partners: Identify, evaluate, and onboard external suppliers with capabilities that align with our packaging requirements. Collaborate closely with selected partners to develop and refine process flows for manufacturing and assembly.
- De-risking and validating new technologies: Design and oversee experiments to test and validate novel packaging techniques ahead of full-scale production. Lead root-cause investigations and failure analysis to troubleshoot and continuously improve reliability.
Requirements
We’re looking for strong experience in packaging technologies, particularly wire-bonding, bumping, and die bonding for thermal and mechanical performance. You should also have a solid understanding of package substrate technologies and tradeoffs, as well as photonic packaging methods (such as grating and edge coupling). Experience working closely with third-party suppliers and coordinating process development is essential, along with clear, confident communication skills across both technical and non-technical teams.
Experience in cryogenic packaging and thermal or mechanical simulation would also be a bonus, but is not required. Most importantly, you’ll be a thoughtful problem-solver who can balance practical manufacturing constraints with the demands of high-performance quantum systems, contributing to the development of scalable, cutting-edge hardware.
Benefits
Oxford Ionics is leading the way in quantum technology, and we need skilled, innovative individuals like you. We offer a range of benefits, including opportunities to further your career with a world-class team, business stock options, generous annual leave, flexible working, private medical and dental insurance for you and your family, and much more. Join us and be part of the future of quantum computing.
Oxford Ionics is committed to equal opportunity for all.
